7th International Conference on Chemical and Polymer Engineering (ICCPE'21)

August 2, 2021 - August 4, 2021 | Prague, Czech Republic
Due to COVID'19 pandemic it held VIRTUALLY


The 7th International Conference on Chemical and Polymer Engineering (ICCPE'21) held Virtually on August 02-04, 2021. ICCPE'21 has been completed with great success and this would not have been possible without the dedication and help of the organizers, the chairs and keynote speakers, scientific committee members, and all participants. Many thanks for their continuous support.

Submissions


Submissions were in the form of extended abstracts, short papers, and full manuscripts.

  • all submitted papers were peer-reviewed
  • the conference proceedings were published under an ISSN and ISBN number
  • each paper were assigned a unique DOI number by Crossref
  • the conference proceedings were indexed by Scopus and Google Scholar
  • the proceedings were permanently archived in Portico (one of the largest community-supported digital archives in the world).


Congress Chair


Dr. Huihe Qiu
Dr. Huihe Qiu

The Hong Kong University of Science & Technology, Hong Kong
Conference Chair

View Profile

Dr. Yuwen Zhang
Dr. Yuwen Zhang

University of Missouri, USA
Conference Co-Chair

View Profile

Keynote Speaker


Dr. Jiang Jianwen
Dr. Jiang Jianwen

National University of Singapore (NUS), Singapore
Keynote Speaker

Biography & Abstract

Dr. Min Xie
Dr. Min Xie

City University of Hong Kong, China
Keynote Speaker

Biography & Abstract

Scientific Committee Members


Dr. Shing Bor Chen, National University of Singapore, Singapore

Dr. Eric S. Fraga, University College London, UK

Dr. Masami Okamoto, Toyota Technological Institute, Japan

Dr. Dimitrios Sidiras, University of Piraeus, Greece

Dr. Minhua Shao, The Hong Kong University of Science and Technology, Hong Kong

Dr. Jingbo Wang, Borealis Polyolefine GmbH, Austria

Best Paper Award Winners

We would like to congratulate the following authors for winning the Best Paper Award:



International ASET Inc.
Avestia

Where2Submit

The Hong Kong University of Science and Technology